Crystal Boule Grinder Wheel
Abrasive grinding wheel used in crystal grinders to shape semiconductor boules to exact diameters and grind orientation flats indicating conductivity type. Under HTS 8487.90.0080 as a part for wafer manufacturing preparation equipment in semiconductor processing. Critical for precise boule dimensions before slicing.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for general industrial grinding applications
Millstones/grinding wheels of agglomerated abrasives default to Chapter 68 without semiconductor specificity.
If parts for general metalworking grinders
If not tied to crystal boule processing, falls under parts for metalworking machinery.
If sold as interchangeable tool for multiple machines
Interchangeable abrasive tools classify under tools rather than specific machinery parts.
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Import Tips & Compliance
• Include resistivity/conductivity flat specifications in documentation to prove semiconductor application
• Certify abrasive composition (e.g
• diamond/CBN) suitable for silicon/gallium arsenide
Related Products under HTS 8487.90.00.80
Czochralski Crystal Puller Crucible
A high-purity graphite or quartz crucible used in Czochralski crystal growers to melt semiconductor materials like silicon for producing monocrystalline boules. It falls under HTS 8487.90.0080 as a specialized part of semiconductor wafer manufacturing machinery, not containing electrical features and not specified elsewhere. This component is essential for the initial growth stage in semiconductor processing.
Semiconductor Wafer Slicing Saw Blade
A diamond-impregnated blade designed for inner-diameter saws that slice ultra-thin wafers from monocrystalline semiconductor boules like silicon. Classified under HTS 8487.90.0080 as a part of wafer preparation machinery in semiconductor manufacturing, lacking electrical features. Ensures precise cuts for subsequent device fabrication.
Wafer Lapping Plate
Cast iron or ceramic plate used in wafer lappers to achieve flatness tolerances on semiconductor wafers prior to polishing. Classifies in HTS 8487.90.0080 as a component of wafer preparation apparatus for semiconductor device fabrication. Ensures surface planarity critical for lithography processes.
Semiconductor Wafer Polishing Pad
Polyurethane polishing pad for chemical mechanical planarization (CMP) of semiconductor wafers to mirror finish. HTS 8487.90.0080 covers it as a consumable part of wafer polishing machinery in semiconductor fabrication. Removes material uniformly for device layer stacking.
Float Zone Crystal Furnace Heater
RF induction heating coil support (non-electrical) for float zone crystal growth furnaces producing high-purity silicon. Under HTS 8487.90.0080 as mechanical part of semiconductor crystal grower, excluding electrical features. Enables zone melting without crucible contamination.
Wafer Grinding Spindle
Precision spindle assembly for wafer grinders that holds grinding wheels for back-thinning semiconductor wafers to final thickness. HTS 8487.90.0080 as machinery part for semiconductor wafer preparation without electrical connectors. Achieves <50 micron wafer thickness.