8487.90.00.80/Crystal Boule Grinder Wheel/Japan

Crystal Boule Grinder Wheel from Japan

Abrasive grinding wheel used in crystal grinders to shape semiconductor boules to exact diameters and grind orientation flats indicating conductivity type. Under HTS 8487.90.0080 as a part for wafer manufacturing preparation equipment in semiconductor processing. Critical for precise boule dimensions before slicing.

Duty Rate — Japan → United States

13.9%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Include resistivity/conductivity flat specifications in documentation to prove semiconductor application

• Certify abrasive composition (e.g

• diamond/CBN) suitable for silicon/gallium arsenide

Crystal Boule Grinder Wheel from Japan — Import Duty Rate | HTS 8487.90.00.80