8487.90.00/CMP Polisher Retaining Ring/Japan

CMP Polisher Retaining Ring from Japan

Consumable retaining ring that contains polishing pad on CMP platen edge while allowing controlled pad wear during semiconductor wafer planarization. Engineered plastic composite part. 8487.90.00 classification.

Duty Rate — Japan → United States

13.9%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document wear rate specifications and material composition for customs

• Confirm ring design prevents pad edge tearing

• Common misclassification as plastic article under Chapter 39

CMP Polisher Retaining Ring from Japan — Import Duty Rate | HTS 8487.90.00