CMP Polisher Retaining Ring from Japan
Consumable retaining ring that contains polishing pad on CMP platen edge while allowing controlled pad wear during semiconductor wafer planarization. Engineered plastic composite part. 8487.90.00 classification.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document wear rate specifications and material composition for customs
• Confirm ring design prevents pad edge tearing
• Common misclassification as plastic article under Chapter 39