8487.90.00/CMP Polisher Retaining Ring/Japan

CMP Polisher Retaining Ring from Japan

Consumable retaining ring that contains polishing pad on CMP platen edge while allowing controlled pad wear during semiconductor wafer planarization. Engineered plastic composite part. 8487.90.00 classification.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document wear rate specifications and material composition for customs

• Confirm ring design prevents pad edge tearing

• Common misclassification as plastic article under Chapter 39