Wafer Slicing Diamond Wire Saw Blade
Precision diamond wire saw blade designed specifically for slicing semiconductor boules into thin wafers with minimal material loss. This consumable cutting part lacks electrical features and is essential for wafer preparation equipment. Classified in 8487.90.00 as other machinery parts.
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More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If generic saw blades not semiconductor-specific
Standard metalworking saw blades fall under Chapter 82 saws and blades.
If imported with complete wafer saw assembly
Complete wafer slicing saws are semiconductor manufacturing machines under 8486.
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Import Tips & Compliance
• Document diamond concentration and wire specifications proving semiconductor wafer cutting purpose
• Ensure blade is imported separately, not assembled in saw
• Avoid reclassification as tool under Chapter 82
Related Products under HTS 8487.90.00
Czochralski Crystal Puller Furnace Chamber
The furnace chamber is a critical replaceable part in Czochralski crystal pullers used to grow monocrystalline silicon boules for semiconductor wafers. It provides the high-temperature controlled environment necessary for the pulling process without electrical components. Classified under 8487.90.00 as a machinery part not specified elsewhere in Chapter 84.
Float Zone Crystal Grower Quartz Crucible
High-purity quartz crucible used in float zone crystal growers to contain molten silicon during the zone refining process for semiconductor material production. This non-electrical part maintains material purity at extreme temperatures. Falls under 8487.90.00 as an unspecified machinery part for semiconductor equipment.
Crystal Boule Grinder Workholding Chuck
Precision workholding chuck for securing semiconductor crystal boules during diameter grinding to wafer specifications. This mechanical part ensures accurate rotation without electrical components. Under 8487.90.00 for unspecified semiconductor grinding machinery parts.
Wafer Lapping Plate
Cast iron or composite lapping plate used in semiconductor wafer grinders/lappers to achieve precise flatness and thickness uniformity on wafer surfaces before fabrication. Purely mechanical surface finishing part without electrical features. Classified 8487.90.00 as other machinery component.
Semiconductor Wafer Polishing Pad
Polyurethane polishing pad engineered for chemical mechanical planarization (CMP) of semiconductor wafers to atomic-level surface finish. This consumable part interfaces with polishing platens in wafer processing equipment. 8487.90.00 for non-electrical machinery parts.
Wafer Handling Vacuum Chuck
Precision vacuum chuck for holding semiconductor wafers during grinding, lapping, and polishing operations without mechanical clamps. Pneumatic-only design excludes electrical connectors. Falls under 8487.90.00 as semiconductor processing machinery part.