Wafer Slicing Diamond Wire Saw Blade from Germany
Precision diamond wire saw blade designed specifically for slicing semiconductor boules into thin wafers with minimal material loss. This consumable cutting part lacks electrical features and is essential for wafer preparation equipment. Classified in 8487.90.00 as other machinery parts.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document diamond concentration and wire specifications proving semiconductor wafer cutting purpose
• Ensure blade is imported separately, not assembled in saw
• Avoid reclassification as tool under Chapter 82