Wafer Slicing Diamond Wire Saw Blade from Japan
Precision diamond wire saw blade designed specifically for slicing semiconductor boules into thin wafers with minimal material loss. This consumable cutting part lacks electrical features and is essential for wafer preparation equipment. Classified in 8487.90.00 as other machinery parts.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document diamond concentration and wire specifications proving semiconductor wafer cutting purpose
• Ensure blade is imported separately, not assembled in saw
• Avoid reclassification as tool under Chapter 82