Wafer Handling Vacuum Chuck
Precision vacuum chuck for holding semiconductor wafers during grinding, lapping, and polishing operations without mechanical clamps. Pneumatic-only design excludes electrical connectors. Falls under 8487.90.00 as semiconductor processing machinery part.
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Import Tips & Compliance
• Document vacuum port specifications and surface flatness tolerances for wafer sizes
• Verify purely pneumatic operation without solenoids
• Pitfall: reclassification to Chapter 84 if electrical vacuum pumps included
Related Products under HTS 8487.90.00
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The furnace chamber is a critical replaceable part in Czochralski crystal pullers used to grow monocrystalline silicon boules for semiconductor wafers. It provides the high-temperature controlled environment necessary for the pulling process without electrical components. Classified under 8487.90.00 as a machinery part not specified elsewhere in Chapter 84.
Float Zone Crystal Grower Quartz Crucible
High-purity quartz crucible used in float zone crystal growers to contain molten silicon during the zone refining process for semiconductor material production. This non-electrical part maintains material purity at extreme temperatures. Falls under 8487.90.00 as an unspecified machinery part for semiconductor equipment.
Wafer Slicing Diamond Wire Saw Blade
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Crystal Boule Grinder Workholding Chuck
Precision workholding chuck for securing semiconductor crystal boules during diameter grinding to wafer specifications. This mechanical part ensures accurate rotation without electrical components. Under 8487.90.00 for unspecified semiconductor grinding machinery parts.
Wafer Lapping Plate
Cast iron or composite lapping plate used in semiconductor wafer grinders/lappers to achieve precise flatness and thickness uniformity on wafer surfaces before fabrication. Purely mechanical surface finishing part without electrical features. Classified 8487.90.00 as other machinery component.
Semiconductor Wafer Polishing Pad
Polyurethane polishing pad engineered for chemical mechanical planarization (CMP) of semiconductor wafers to atomic-level surface finish. This consumable part interfaces with polishing platens in wafer processing equipment. 8487.90.00 for non-electrical machinery parts.