Wafer Handling Vacuum Chuck from China
Precision vacuum chuck for holding semiconductor wafers during grinding, lapping, and polishing operations without mechanical clamps. Pneumatic-only design excludes electrical connectors. Falls under 8487.90.00 as semiconductor processing machinery part.
Duty Rate — China → United States
41.4%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Document vacuum port specifications and surface flatness tolerances for wafer sizes
• Verify purely pneumatic operation without solenoids
• Pitfall: reclassification to Chapter 84 if electrical vacuum pumps included