Wafer Handling Vacuum Chuck from Japan
Precision vacuum chuck for holding semiconductor wafers during grinding, lapping, and polishing operations without mechanical clamps. Pneumatic-only design excludes electrical connectors. Falls under 8487.90.00 as semiconductor processing machinery part.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document vacuum port specifications and surface flatness tolerances for wafer sizes
• Verify purely pneumatic operation without solenoids
• Pitfall: reclassification to Chapter 84 if electrical vacuum pumps included