Wafer Lapping Plate
Cast iron or composite lapping plate used in semiconductor wafer grinders/lappers to achieve precise flatness and thickness uniformity on wafer surfaces before fabrication. Purely mechanical surface finishing part without electrical features. Classified 8487.90.00 as other machinery component.
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More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If lapping plates for general metalworking
Standard lapping/polishing machines for ordinary materials fall under 8460.
If primarily ceramic grinding media
Ceramic lapping materials may shift to Chapter 68 articles.
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Import Tips & Compliance
• Specify plate material and flatness tolerances proving semiconductor wafer application
• Include maintenance records showing lapping slurry compatibility
• Avoid glass industry classification under Chapter 70
Related Products under HTS 8487.90.00
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Wafer Handling Vacuum Chuck
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