Wafer Lapping Plate from Mexico
Cast iron or composite lapping plate used in semiconductor wafer grinders/lappers to achieve precise flatness and thickness uniformity on wafer surfaces before fabrication. Purely mechanical surface finishing part without electrical features. Classified 8487.90.00 as other machinery component.
Duty Rate — Mexico → United States
13.9%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify plate material and flatness tolerances proving semiconductor wafer application
• Include maintenance records showing lapping slurry compatibility
• Avoid glass industry classification under Chapter 70