Wafer Lapping Plate from Mexico
Cast iron or composite lapping plate used in semiconductor wafer grinders/lappers to achieve precise flatness and thickness uniformity on wafer surfaces before fabrication. Purely mechanical surface finishing part without electrical features. Classified 8487.90.00 as other machinery component.
Duty Rate — Mexico → United States
13.9%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Specify plate material and flatness tolerances proving semiconductor wafer application
• Include maintenance records showing lapping slurry compatibility
• Avoid glass industry classification under Chapter 70