Wafer Lapping Plate from China
Cast iron or composite lapping plate used in semiconductor wafer grinders/lappers to achieve precise flatness and thickness uniformity on wafer surfaces before fabrication. Purely mechanical surface finishing part without electrical features. Classified 8487.90.00 as other machinery component.
Duty Rate — China → United States
41.4%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Specify plate material and flatness tolerances proving semiconductor wafer application
• Include maintenance records showing lapping slurry compatibility
• Avoid glass industry classification under Chapter 70