Wafer Sorter Cassette Adapter Plate
Precision adapter plate aligning FOUP/FOF cassette interfaces with semiconductor wafer sorting/inspection equipment loading stations. Ensures contamination-free wafer transfer. Mechanical alignment part under 8487.90.00.
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More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If part of complete wafer handling robot
Complete wafer handling/sorting machines are semiconductor apparatus.
If generic metal mounting plates
Standard fabricated metal parts go to Chapter 73.
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Import Tips & Compliance
• Verify SEMI-standard dimensions for FOUP compatibility
• Include surface finish specs for particle control
• Pitfall: classification as general semiconductor handling under 8486
Related Products under HTS 8487.90.00
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The furnace chamber is a critical replaceable part in Czochralski crystal pullers used to grow monocrystalline silicon boules for semiconductor wafers. It provides the high-temperature controlled environment necessary for the pulling process without electrical components. Classified under 8487.90.00 as a machinery part not specified elsewhere in Chapter 84.
Float Zone Crystal Grower Quartz Crucible
High-purity quartz crucible used in float zone crystal growers to contain molten silicon during the zone refining process for semiconductor material production. This non-electrical part maintains material purity at extreme temperatures. Falls under 8487.90.00 as an unspecified machinery part for semiconductor equipment.
Wafer Slicing Diamond Wire Saw Blade
Precision diamond wire saw blade designed specifically for slicing semiconductor boules into thin wafers with minimal material loss. This consumable cutting part lacks electrical features and is essential for wafer preparation equipment. Classified in 8487.90.00 as other machinery parts.
Crystal Boule Grinder Workholding Chuck
Precision workholding chuck for securing semiconductor crystal boules during diameter grinding to wafer specifications. This mechanical part ensures accurate rotation without electrical components. Under 8487.90.00 for unspecified semiconductor grinding machinery parts.
Wafer Lapping Plate
Cast iron or composite lapping plate used in semiconductor wafer grinders/lappers to achieve precise flatness and thickness uniformity on wafer surfaces before fabrication. Purely mechanical surface finishing part without electrical features. Classified 8487.90.00 as other machinery component.
Semiconductor Wafer Polishing Pad
Polyurethane polishing pad engineered for chemical mechanical planarization (CMP) of semiconductor wafers to atomic-level surface finish. This consumable part interfaces with polishing platens in wafer processing equipment. 8487.90.00 for non-electrical machinery parts.