Coolant Nozzle Assembly for Wafer Saws
Precision nozzle directs coolant to diamond blades in wafer slicing saws, preventing thermal damage to semiconductor material. HTS 8466.91.50.00 for accessories of 8464 sawing machines.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| šØš³China | Free | +35.0% | 35% |
| š²š½Mexico | Free | +10.0% | 10% |
| šØš¦Canada | Free | +10.0% | 10% |
| š©šŖGermany | Free | +10.0% | 10% |
| šÆšµJapan | Free | +10.0% | 10% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If generic mechanical appliances for spraying
Non-machine-specific nozzles fall under Chapter 84.
If tubing only, no nozzle fitting
Rubber tubes classify by material in Chapter 40.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
ā¢ Specify flow rate and material compatibility (e.g
ā¢ silicon-safe) in specs
ā¢ Include installation diagrams showing 8464 integration
ā¢ Avoid classifying as plumbing parts; link to saw kerf cooling
Related Products under HTS 8466.91.50.00
Polishing Slurry Feed Arm for Wafer Polishers
Robotic arm dispenses slurry evenly across rotating wafer polishers for mirror-finish surfaces. HTS 8466.91.50.00 part for 8464 polishers in wafer manufacturing.
CNC Spindle Cartridge for Wafer Grinding Machines
This high-precision spindle cartridge is designed specifically for CNC wafer grinders used in semiconductor wafer preparation, ensuring ultra-flat surfaces for fabrication. It falls under HTS 8466.91.50.00 as a part for machines of heading 8464, which includes grinding machines tailored for semiconductor processing.
Diamond Grinding Wheel Arbor for Wafer Polishers
A specialized arbor holding diamond-impregnated grinding wheels for semiconductor wafer polishers, achieving nanometer-level flatness. Classified under HTS 8466.91.50.00 for parts of 8464 grinding machines used in wafer lapping and polishing processes.
Edge Profiling Tool Holder for Wafer Grinders
Tool holder for edge grinders that profile semiconductor wafers to precise geometries post-slicing. Part of HTS 8466.91.50.00 for heading 8464 wafer prep grinders.
Boule Alignment Fixture for Crystal Slicers
Fixture aligns crystal boules in slicing saws for uniform wafer thickness in semiconductor production. Classified HTS 8466.91.50.00 as special attachment for 8464 machines.
Wafer Chuck Vacuum Plate for Crystal Grinders
Precision vacuum chuck plate secures semiconductor crystal boules during grinding to exact diameters and flats indicating conductivity. It is a part for 8464 grinding machines, thus under HTS 8466.91.50.00 per statistical notes on wafer prep equipment.