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8466.91.50.00/Coolant Nozzle Assembly for Wafer Saws/Japan

Coolant Nozzle Assembly for Wafer Saws from Japan

Precision nozzle directs coolant to diamond blades in wafer slicing saws, preventing thermal damage to semiconductor material. HTS 8466.91.50.00 for accessories of 8464 sawing machines.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify flow rate and material compatibility (e.g

• silicon-safe) in specs

• Include installation diagrams showing 8464 integration

• Avoid classifying as plumbing parts; link to saw kerf cooling

Coolant Nozzle Assembly for Wafer Saws from Japan — Import Duty Rate | HTS 8466.91.50.00