Diamond Grinding Wheel Arbor for Wafer Polishers from Germany
A specialized arbor holding diamond-impregnated grinding wheels for semiconductor wafer polishers, achieving nanometer-level flatness. Classified under HTS 8466.91.50.00 for parts of 8464 grinding machines used in wafer lapping and polishing processes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide evidence of diamond grit specs and wafer tolerance compatibility for correct 8464 attribution
• Label as 'semiconductor-specific' and include machine model compatibility in commercial invoices
• Avoid bulk classification errors by distinguishing from general abrasive tool holders