Diamond Grinding Wheel Arbor for Wafer Polishers from Germany
A specialized arbor holding diamond-impregnated grinding wheels for semiconductor wafer polishers, achieving nanometer-level flatness. Classified under HTS 8466.91.50.00 for parts of 8464 grinding machines used in wafer lapping and polishing processes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Provide evidence of diamond grit specs and wafer tolerance compatibility for correct 8464 attribution
• Label as 'semiconductor-specific' and include machine model compatibility in commercial invoices
• Avoid bulk classification errors by distinguishing from general abrasive tool holders