Precision Collet for Wafer Slicing Saw Blades
High-accuracy collet holds diamond blades in wafer slicing saws that cut monocrystalline boules into thin wafers. Fits HTS 8466.91.50.00 as an accessory for 8464 sawing/grinding machines in semiconductor wafer manufacturing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| šØš³China | Free | +35.0% | 35% |
| š²š½Mexico | Free | +10.0% | 10% |
| šØš¦Canada | Free | +10.0% | 10% |
| š©šŖGermany | Free | +10.0% | 10% |
| šÆšµJapan | Free | +10.0% | 10% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for heading 8465 sawing machines
8465 covers saws for metals/stone, not semiconductor-specific.
If sold as individual saw tool without machine fit
Hand tools or saw blades classify in Chapter 82.
If for crystal boule handling in growth machines
Unspecified semiconductor machines use Chapter 84 residuals.
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Import Tips & Compliance
ā¢ Include blade RPM and kerf width specs proving use in statistical note (b)(B) wafer slicing
ā¢ Pair with machine photos or diagrams in entry docs to link to heading 8464
Related Products under HTS 8466.91.50.00
Polishing Slurry Feed Arm for Wafer Polishers
Robotic arm dispenses slurry evenly across rotating wafer polishers for mirror-finish surfaces. HTS 8466.91.50.00 part for 8464 polishers in wafer manufacturing.
CNC Spindle Cartridge for Wafer Grinding Machines
This high-precision spindle cartridge is designed specifically for CNC wafer grinders used in semiconductor wafer preparation, ensuring ultra-flat surfaces for fabrication. It falls under HTS 8466.91.50.00 as a part for machines of heading 8464, which includes grinding machines tailored for semiconductor processing.
Diamond Grinding Wheel Arbor for Wafer Polishers
A specialized arbor holding diamond-impregnated grinding wheels for semiconductor wafer polishers, achieving nanometer-level flatness. Classified under HTS 8466.91.50.00 for parts of 8464 grinding machines used in wafer lapping and polishing processes.
Coolant Nozzle Assembly for Wafer Saws
Precision nozzle directs coolant to diamond blades in wafer slicing saws, preventing thermal damage to semiconductor material. HTS 8466.91.50.00 for accessories of 8464 sawing machines.
Edge Profiling Tool Holder for Wafer Grinders
Tool holder for edge grinders that profile semiconductor wafers to precise geometries post-slicing. Part of HTS 8466.91.50.00 for heading 8464 wafer prep grinders.
Boule Alignment Fixture for Crystal Slicers
Fixture aligns crystal boules in slicing saws for uniform wafer thickness in semiconductor production. Classified HTS 8466.91.50.00 as special attachment for 8464 machines.