Precision Collet for Wafer Slicing Saw Blades from Japan
High-accuracy collet holds diamond blades in wafer slicing saws that cut monocrystalline boules into thin wafers. Fits HTS 8466.91.50.00 as an accessory for 8464 sawing/grinding machines in semiconductor wafer manufacturing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include blade RPM and kerf width specs proving use in statistical note (b)(B) wafer slicing
• Pair with machine photos or diagrams in entry docs to link to heading 8464