Precision Collet for Wafer Slicing Saw Blades from Germany
High-accuracy collet holds diamond blades in wafer slicing saws that cut monocrystalline boules into thin wafers. Fits HTS 8466.91.50.00 as an accessory for 8464 sawing/grinding machines in semiconductor wafer manufacturing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include blade RPM and kerf width specs proving use in statistical note (b)(B) wafer slicing
• Pair with machine photos or diagrams in entry docs to link to heading 8464