Precision Collet for Wafer Slicing Saw Blades from Mexico
High-accuracy collet holds diamond blades in wafer slicing saws that cut monocrystalline boules into thin wafers. Fits HTS 8466.91.50.00 as an accessory for 8464 sawing/grinding machines in semiconductor wafer manufacturing.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include blade RPM and kerf width specs proving use in statistical note (b)(B) wafer slicing
• Pair with machine photos or diagrams in entry docs to link to heading 8464