Motor Mounting Flange for Float Zone Crystal Pullers

Custom flange mounts rotation motors in float zone crystal pullers/grinders for semiconductor boule preparation. Under HTS 8466.91.50.00 as part for 8464 grinding machines per statistical note (a)(i).

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
šŸ‡ØšŸ‡³ChinaFree+35.0%35%
šŸ‡²šŸ‡½MexicoFree+10.0%10%
šŸ‡ØšŸ‡¦CanadaFree+10.0%10%
šŸ‡©šŸ‡ŖGermanyFree+10.0%10%
šŸ‡ÆšŸ‡µJapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8503.00.95Higher: 38% vs 35%

If generic motor subassembly

Parts of electric motors classify separately unless machine-specific.

8479.90Lower: 10% vs 35%

If for unlisted semiconductor processing machines

Other semiconductor machines use 8479 residuals.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

• Reference Czochralski/float zone methods in docs per statistical notes

• Require OEM compatibility statements for 8464 principal use

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Robotic arm dispenses slurry evenly across rotating wafer polishers for mirror-finish surfaces. HTS 8466.91.50.00 part for 8464 polishers in wafer manufacturing.

CNC Spindle Cartridge for Wafer Grinding Machines

This high-precision spindle cartridge is designed specifically for CNC wafer grinders used in semiconductor wafer preparation, ensuring ultra-flat surfaces for fabrication. It falls under HTS 8466.91.50.00 as a part for machines of heading 8464, which includes grinding machines tailored for semiconductor processing.

Diamond Grinding Wheel Arbor for Wafer Polishers

A specialized arbor holding diamond-impregnated grinding wheels for semiconductor wafer polishers, achieving nanometer-level flatness. Classified under HTS 8466.91.50.00 for parts of 8464 grinding machines used in wafer lapping and polishing processes.

Coolant Nozzle Assembly for Wafer Saws

Precision nozzle directs coolant to diamond blades in wafer slicing saws, preventing thermal damage to semiconductor material. HTS 8466.91.50.00 for accessories of 8464 sawing machines.

Edge Profiling Tool Holder for Wafer Grinders

Tool holder for edge grinders that profile semiconductor wafers to precise geometries post-slicing. Part of HTS 8466.91.50.00 for heading 8464 wafer prep grinders.

Boule Alignment Fixture for Crystal Slicers

Fixture aligns crystal boules in slicing saws for uniform wafer thickness in semiconductor production. Classified HTS 8466.91.50.00 as special attachment for 8464 machines.