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8480.49.00.90/Edge Grinding Wafer Mold Carrier/Canada

Edge Grinding Wafer Mold Carrier from Canada

Mold carrier system for semiconductor wafer edge grinding to prevent chipping during handling. Falls under HTS 8480.49.0090 as other molds for wafer preparation equipment.

Duty Rate — Canada → United States

13.1%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Specify edge profile geometries supported

• Include vacuum chuck integration documentation

• Common misclassification as wafer handling robotics