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8480.49.00.90/Edge Grinding Wafer Mold Carrier/Japan

Edge Grinding Wafer Mold Carrier from Japan

Mold carrier system for semiconductor wafer edge grinding to prevent chipping during handling. Falls under HTS 8480.49.0090 as other molds for wafer preparation equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify edge profile geometries supported

• Include vacuum chuck integration documentation

• Common misclassification as wafer handling robotics