8480.49.00.90/Edge Grinding Wafer Mold Carrier/Japan

Edge Grinding Wafer Mold Carrier from Japan

Mold carrier system for semiconductor wafer edge grinding to prevent chipping during handling. Falls under HTS 8480.49.0090 as other molds for wafer preparation equipment.

Duty Rate — Japan → United States

13.1%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify edge profile geometries supported

• Include vacuum chuck integration documentation

• Common misclassification as wafer handling robotics

Edge Grinding Wafer Mold Carrier from Japan — Import Duty Rate | HTS 8480.49.00.90