8480.49.00.90/Edge Grinding Wafer Mold Carrier/Germany

Edge Grinding Wafer Mold Carrier from Germany

Mold carrier system for semiconductor wafer edge grinding to prevent chipping during handling. Falls under HTS 8480.49.0090 as other molds for wafer preparation equipment.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

Calculate with your customs value Verify classification with AI

Import Tips

• Specify edge profile geometries supported

• Include vacuum chuck integration documentation

• Common misclassification as wafer handling robotics