Silicon Wafer Polishing Slurry Mold from Germany
Mold for polishing pads/slurry distribution rings used in final wafer surface preparation for semiconductor fabrication. HTS 8480.49.0090 as other molds for metal carbide polishing equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document surface finish specifications (angstrom-level flatness)
• Specify use in chemical mechanical planarization (CMP) tools