8480.49.00.90/Silicon Wafer Polishing Slurry Mold/Germany

Silicon Wafer Polishing Slurry Mold from Germany

Mold for polishing pads/slurry distribution rings used in final wafer surface preparation for semiconductor fabrication. HTS 8480.49.0090 as other molds for metal carbide polishing equipment.

Duty Rate — Germany → United States

13.1%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document surface finish specifications (angstrom-level flatness)

• Specify use in chemical mechanical planarization (CMP) tools

Silicon Wafer Polishing Slurry Mold from Germany — Import Duty Rate | HTS 8480.49.00.90