Silicon Wafer Polishing Slurry Mold from Germany
Mold for polishing pads/slurry distribution rings used in final wafer surface preparation for semiconductor fabrication. HTS 8480.49.0090 as other molds for metal carbide polishing equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document surface finish specifications (angstrom-level flatness)
• Specify use in chemical mechanical planarization (CMP) tools