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8480.49.00.90/Silicon Wafer Polishing Slurry Mold/Japan

Silicon Wafer Polishing Slurry Mold from Japan

Mold for polishing pads/slurry distribution rings used in final wafer surface preparation for semiconductor fabrication. HTS 8480.49.0090 as other molds for metal carbide polishing equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document surface finish specifications (angstrom-level flatness)

• Specify use in chemical mechanical planarization (CMP) tools