</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8480.49.00.90/Silicon Wafer Polishing Slurry Mold/Mexico

Silicon Wafer Polishing Slurry Mold from Mexico

Mold for polishing pads/slurry distribution rings used in final wafer surface preparation for semiconductor fabrication. HTS 8480.49.0090 as other molds for metal carbide polishing equipment.

Duty Rate — Mexico → United States

13.1%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Calculate with your customs valueVerify classification with AI

Import Tips

• Document surface finish specifications (angstrom-level flatness)

• Specify use in chemical mechanical planarization (CMP) tools