Of articles of subheading 8479.89.10 or 8479.89.70
Machines and mechanical appliances having individual functions, not specified or included elsewhere in this chapter; parts thereof: > Parts: > Of articles of subheading 8479.89.10 or 8479.89.70
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Products classified under HTS 8479.90.41.00
Float Zone Crystal Grower RF Coil
Radio frequency induction coil replacement part for float zone crystal growers that produce high-purity silicon crystals for semiconductor wafers. Essential for localized melting in zone refining process. Falls under 8479.90.41.00 as part of wafer manufacturing crystal growers/pullers.
Crystal Boule Grinder Spindle
High-precision spindle assembly for crystal grinders that shape semiconductor boules to exact wafer diameters and grind orientation flats. Critical for diameter control and flat marking per conductivity specs. Part of 8479.89.10 crystal grinders under 8479.90.41.00.
Wafer Lapping Machine Workholder
Vacuum workholder plate for wafer lappers that hold silicon wafers during precision lapping to achieve required thickness and flatness tolerances. Designed for semiconductor wafer preparation before fabrication. Part of 8479.89.10 wafer preparation equipment under 8479.90.41.00.
Semiconductor Wafer Polishing Platen
Rotary platen assembly for wafer polishers that create mirror-finish surfaces on semiconductor wafers prior to device fabrication. Maintains flatness critical for photolithography overlay. Classified under 8479.90.41.00 as part of wafer polishers in 8479.89.10.
Crystal Grower Crucible Rotation Mechanism
Motorized rotation drive for quartz crucibles in Czochralski crystal pullers, ensuring uniform dopant distribution during silicon ingot growth. Critical for consistent resistivity across boule diameter. Part of 8479.89.10 crystal growers under 8479.90.41.00.
Wafer Grinder Coolant Distribution Ring
Nozzle ring assembly that evenly distributes coolant during crystal boule and wafer grinding operations, preventing thermal damage to semiconductor material. Designed for sub-micron precision grinding. Part of 8479.89.10 wafer grinders under 8479.90.41.00.
Wire Saw Slurry Recirculation Pump
Specialized peristaltic pump for recirculating diamond slurry in wafer slicing wire saws, maintaining consistent abrasive concentration for thin kerf slicing. Critical for minimizing wafer thickness variation (TTV). Part of 8479.89.10 wafer slicing saws under 8479.90.41.00.
Wafer Polisher Load Cell Assembly
Precision load cell sensor array for wafer polishing machines that monitors and controls downforce to achieve nanometer-level surface flatness. Essential for CMP process development. Part of 8479.89.10 wafer polishers under 8479.90.41.00.
Crystal Puller Seed Clip Holder
High-temperature seed crystal holder for Czochralski pullers that dips seed into silicon melt to initiate controlled boule growth. Made from specialized molybdenum alloys. Part of 8479.89.10 crystal pullers under 8479.90.41.00.
Boule Grinder Diameter Gauge
In-process laser diameter measurement gauge for crystal boule grinders ensuring wafers cut from boule meet SEMI diameter tolerances (±0.5mm). Real-time feedback to CNC controls. Part of 8479.89.10 crystal grinders under 8479.90.41.00.
Wafer Sorter Cassette Elevator
Automated cassette elevator mechanism for wafer preparation equipment that transfers FOUPs/cassettes between process modules while maintaining contamination control. Part of 8479.89.10 wafer preparation systems under 8479.90.41.00.
Lapper Slurry Flow Controller
Precision flow control valve assembly for wafer lapping machines that regulates nanoliter/minute slurry delivery for consistent material removal rates. Maintains bow/warp specifications. Part of 8479.89.10 wafer lappers under 8479.90.41.00.
Polisher Head Pressure Bladder
Replaceable elastomeric bladder for chemical mechanical polishing (CMP) heads that provides uniform pressure distribution across entire wafer surface. Achieves <1% non-uniformity. Part of 8479.89.10 wafer polishers under 8479.90.41.00.
Czochralski Crystal Puller Heater Assembly
Replacement heater coil assembly for Czochralski crystal pullers used in growing monocrystalline silicon boules for semiconductor wafers. This part maintains precise temperatures during the crystal growth process. Classified under 8479.90.41.00 as a part of crystal growers/pullers in 8479.89.10.
Wafer Slicing Diamond Wire Guide
Precision guide assembly for diamond wire wafer slicing saws that cut semiconductor boules into thin wafers. Ensures wire alignment and tension during high-precision slicing. Classified as part of wafer slicing saws under 8479.89.10 per 8479.90.41.00.