Wire Saw Slurry Recirculation Pump
Specialized peristaltic pump for recirculating diamond slurry in wafer slicing wire saws, maintaining consistent abrasive concentration for thin kerf slicing. Critical for minimizing wafer thickness variation (TTV). Part of 8479.89.10 wafer slicing saws under 8479.90.41.00.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general rotary positive displacement pumps
Pumps classifiable by type regardless of slurry application
If parts for other semiconductor apparatus
If not specifically for wafer slicing saws in 8479.89.10
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Import Tips & Compliance
• Include slurry particle size specs (avg 20μm diamond) and flow rates,Provide wire saw model compatibility documentation,Distinguish from general slurry pumps under 8413.60
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