Wafer Lapping Machine Workholder
Vacuum workholder plate for wafer lappers that hold silicon wafers during precision lapping to achieve required thickness and flatness tolerances. Designed for semiconductor wafer preparation before fabrication. Part of 8479.89.10 wafer preparation equipment under 8479.90.41.00.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If considered general vacuum appliance
General vacuum valves/appliances classify under 8481, not semiconductor-specific
If parts of general pumps
Pump parts without semiconductor specificity go to Chapter 84 pumps section
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Provide total thickness variation (TTV) specs this workholder achieves (<1μm),Include vacuum specifications and wafer size compatibility (200mm, 300mm, 450mm),Avoid 8481 classification for general taps/valves
Related Products under HTS 8479.90.41.00
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Radio frequency induction coil replacement part for float zone crystal growers that produce high-purity silicon crystals for semiconductor wafers. Essential for localized melting in zone refining process. Falls under 8479.90.41.00 as part of wafer manufacturing crystal growers/pullers.
Crystal Boule Grinder Spindle
High-precision spindle assembly for crystal grinders that shape semiconductor boules to exact wafer diameters and grind orientation flats. Critical for diameter control and flat marking per conductivity specs. Part of 8479.89.10 crystal grinders under 8479.90.41.00.
Semiconductor Wafer Polishing Platen
Rotary platen assembly for wafer polishers that create mirror-finish surfaces on semiconductor wafers prior to device fabrication. Maintains flatness critical for photolithography overlay. Classified under 8479.90.41.00 as part of wafer polishers in 8479.89.10.
Crystal Grower Crucible Rotation Mechanism
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Wafer Grinder Coolant Distribution Ring
Nozzle ring assembly that evenly distributes coolant during crystal boule and wafer grinding operations, preventing thermal damage to semiconductor material. Designed for sub-micron precision grinding. Part of 8479.89.10 wafer grinders under 8479.90.41.00.
Wire Saw Slurry Recirculation Pump
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