Wafer Grinder Coolant Distribution Ring
Nozzle ring assembly that evenly distributes coolant during crystal boule and wafer grinding operations, preventing thermal damage to semiconductor material. Designed for sub-micron precision grinding. Part of 8479.89.10 wafer grinders under 8479.90.41.00.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general mechanical appliances for spraying
Spray nozzles without semiconductor specificity classify under Chapter 84 fluid handling
If parts of coolant pumps
Pump parts go to pump headings regardless of application
Not sure which classification is right?
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Import Tips & Compliance
• Specify coolant flow rate and pressure specs for semiconductor grinding,Document compatibility with specific grinder models in 8479.89.10,Not general nozzles under 8424
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