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8479.90.41.00/Wafer Grinder Coolant Distribution Ring/Japan

Wafer Grinder Coolant Distribution Ring from Japan

Nozzle ring assembly that evenly distributes coolant during crystal boule and wafer grinding operations, preventing thermal damage to semiconductor material. Designed for sub-micron precision grinding. Part of 8479.89.10 wafer grinders under 8479.90.41.00.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify coolant flow rate and pressure specs for semiconductor grinding,Document compatibility with specific grinder models in 8479.89.10,Not general nozzles under 8424

Wafer Grinder Coolant Distribution Ring from Japan — Import Duty Rate | HTS 8479.90.41.00