Wafer Grinder Coolant Distribution Ring from China
Nozzle ring assembly that evenly distributes coolant during crystal boule and wafer grinding operations, preventing thermal damage to semiconductor material. Designed for sub-micron precision grinding. Part of 8479.89.10 wafer grinders under 8479.90.41.00.
Duty Rate — China → United States
17.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Specify coolant flow rate and pressure specs for semiconductor grinding,Document compatibility with specific grinder models in 8479.89.10,Not general nozzles under 8424