8479.90.41.00/Wafer Lapping Machine Workholder/Japan

Wafer Lapping Machine Workholder from Japan

Vacuum workholder plate for wafer lappers that hold silicon wafers during precision lapping to achieve required thickness and flatness tolerances. Designed for semiconductor wafer preparation before fabrication. Part of 8479.89.10 wafer preparation equipment under 8479.90.41.00.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Provide total thickness variation (TTV) specs this workholder achieves (<1μm),Include vacuum specifications and wafer size compatibility (200mm, 300mm, 450mm),Avoid 8481 classification for general taps/valves