8479.90.41.00/Wafer Lapping Machine Workholder/Germany

Wafer Lapping Machine Workholder from Germany

Vacuum workholder plate for wafer lappers that hold silicon wafers during precision lapping to achieve required thickness and flatness tolerances. Designed for semiconductor wafer preparation before fabrication. Part of 8479.89.10 wafer preparation equipment under 8479.90.41.00.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

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Import Tips

• Provide total thickness variation (TTV) specs this workholder achieves (<1μm),Include vacuum specifications and wafer size compatibility (200mm, 300mm, 450mm),Avoid 8481 classification for general taps/valves