Wafer Lapping Machine Workholder from China
Vacuum workholder plate for wafer lappers that hold silicon wafers during precision lapping to achieve required thickness and flatness tolerances. Designed for semiconductor wafer preparation before fabrication. Part of 8479.89.10 wafer preparation equipment under 8479.90.41.00.
Duty Rate — China → United States
17.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Provide total thickness variation (TTV) specs this workholder achieves (<1μm),Include vacuum specifications and wafer size compatibility (200mm, 300mm, 450mm),Avoid 8481 classification for general taps/valves