Wire Saw Slurry Recirculation Pump from Japan
Specialized peristaltic pump for recirculating diamond slurry in wafer slicing wire saws, maintaining consistent abrasive concentration for thin kerf slicing. Critical for minimizing wafer thickness variation (TTV). Part of 8479.89.10 wafer slicing saws under 8479.90.41.00.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include slurry particle size specs (avg 20μm diamond) and flow rates,Provide wire saw model compatibility documentation,Distinguish from general slurry pumps under 8413.60