8479.90.41.00/Wire Saw Slurry Recirculation Pump/Japan

Wire Saw Slurry Recirculation Pump from Japan

Specialized peristaltic pump for recirculating diamond slurry in wafer slicing wire saws, maintaining consistent abrasive concentration for thin kerf slicing. Critical for minimizing wafer thickness variation (TTV). Part of 8479.89.10 wafer slicing saws under 8479.90.41.00.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include slurry particle size specs (avg 20μm diamond) and flow rates,Provide wire saw model compatibility documentation,Distinguish from general slurry pumps under 8413.60