Wire Saw Slurry Recirculation Pump from China
Specialized peristaltic pump for recirculating diamond slurry in wafer slicing wire saws, maintaining consistent abrasive concentration for thin kerf slicing. Critical for minimizing wafer thickness variation (TTV). Part of 8479.89.10 wafer slicing saws under 8479.90.41.00.
Duty Rate — China → United States
20%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Include slurry particle size specs (avg 20μm diamond) and flow rates,Provide wire saw model compatibility documentation,Distinguish from general slurry pumps under 8413.60