Wire Saw Slurry Recirculation Pump from Canada
Specialized peristaltic pump for recirculating diamond slurry in wafer slicing wire saws, maintaining consistent abrasive concentration for thin kerf slicing. Critical for minimizing wafer thickness variation (TTV). Part of 8479.89.10 wafer slicing saws under 8479.90.41.00.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include slurry particle size specs (avg 20μm diamond) and flow rates,Provide wire saw model compatibility documentation,Distinguish from general slurry pumps under 8413.60