Lapper Slurry Flow Controller

Precision flow control valve assembly for wafer lapping machines that regulates nanoliter/minute slurry delivery for consistent material removal rates. Maintains bow/warp specifications. Part of 8479.89.10 wafer lappers under 8479.90.41.00.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+17.5%17.5%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8481.40.00Higher: 37% vs 17.5%

If general safety/control valves

Valves classifiable by function regardless of process fluid

8479.90Same rate: 17.5%

If parts of other process control equipment

If not specific to wafer lappers in 8479.89.10

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Specify flow precision (±1% at 10-100ml/min range),Include abrasive slurry compatibility (colloidal silica, alumina),Distinguish from general valves under 8481

Related Products under HTS 8479.90.41.00

Float Zone Crystal Grower RF Coil

Radio frequency induction coil replacement part for float zone crystal growers that produce high-purity silicon crystals for semiconductor wafers. Essential for localized melting in zone refining process. Falls under 8479.90.41.00 as part of wafer manufacturing crystal growers/pullers.

Crystal Boule Grinder Spindle

High-precision spindle assembly for crystal grinders that shape semiconductor boules to exact wafer diameters and grind orientation flats. Critical for diameter control and flat marking per conductivity specs. Part of 8479.89.10 crystal grinders under 8479.90.41.00.

Wafer Lapping Machine Workholder

Vacuum workholder plate for wafer lappers that hold silicon wafers during precision lapping to achieve required thickness and flatness tolerances. Designed for semiconductor wafer preparation before fabrication. Part of 8479.89.10 wafer preparation equipment under 8479.90.41.00.

Semiconductor Wafer Polishing Platen

Rotary platen assembly for wafer polishers that create mirror-finish surfaces on semiconductor wafers prior to device fabrication. Maintains flatness critical for photolithography overlay. Classified under 8479.90.41.00 as part of wafer polishers in 8479.89.10.

Crystal Grower Crucible Rotation Mechanism

Motorized rotation drive for quartz crucibles in Czochralski crystal pullers, ensuring uniform dopant distribution during silicon ingot growth. Critical for consistent resistivity across boule diameter. Part of 8479.89.10 crystal growers under 8479.90.41.00.

Wafer Grinder Coolant Distribution Ring

Nozzle ring assembly that evenly distributes coolant during crystal boule and wafer grinding operations, preventing thermal damage to semiconductor material. Designed for sub-micron precision grinding. Part of 8479.89.10 wafer grinders under 8479.90.41.00.