Wafer Slicing Diamond Wire Guide
Precision guide assembly for diamond wire wafer slicing saws that cut semiconductor boules into thin wafers. Ensures wire alignment and tension during high-precision slicing. Classified as part of wafer slicing saws under 8479.89.10 per 8479.90.41.00.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If considered general machine tool part
Parts for metalworking saws classify under Chapter 84 machine tools, not semiconductor equipment
If wire saw consumable guides
Tool parts for saw wires may go to Chapter 82 if not machine-specific
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Document the specific wafer slicing saw model (8479.89.10) this guide fits,Include wafer thickness specifications (typically 100-300μm) in technical data
Related Products under HTS 8479.90.41.00
Float Zone Crystal Grower RF Coil
Radio frequency induction coil replacement part for float zone crystal growers that produce high-purity silicon crystals for semiconductor wafers. Essential for localized melting in zone refining process. Falls under 8479.90.41.00 as part of wafer manufacturing crystal growers/pullers.
Crystal Boule Grinder Spindle
High-precision spindle assembly for crystal grinders that shape semiconductor boules to exact wafer diameters and grind orientation flats. Critical for diameter control and flat marking per conductivity specs. Part of 8479.89.10 crystal grinders under 8479.90.41.00.
Wafer Lapping Machine Workholder
Vacuum workholder plate for wafer lappers that hold silicon wafers during precision lapping to achieve required thickness and flatness tolerances. Designed for semiconductor wafer preparation before fabrication. Part of 8479.89.10 wafer preparation equipment under 8479.90.41.00.
Semiconductor Wafer Polishing Platen
Rotary platen assembly for wafer polishers that create mirror-finish surfaces on semiconductor wafers prior to device fabrication. Maintains flatness critical for photolithography overlay. Classified under 8479.90.41.00 as part of wafer polishers in 8479.89.10.
Crystal Grower Crucible Rotation Mechanism
Motorized rotation drive for quartz crucibles in Czochralski crystal pullers, ensuring uniform dopant distribution during silicon ingot growth. Critical for consistent resistivity across boule diameter. Part of 8479.89.10 crystal growers under 8479.90.41.00.
Wafer Grinder Coolant Distribution Ring
Nozzle ring assembly that evenly distributes coolant during crystal boule and wafer grinding operations, preventing thermal damage to semiconductor material. Designed for sub-micron precision grinding. Part of 8479.89.10 wafer grinders under 8479.90.41.00.