8479.90.41.00/Wafer Slicing Diamond Wire Guide/Japan

Wafer Slicing Diamond Wire Guide from Japan

Precision guide assembly for diamond wire wafer slicing saws that cut semiconductor boules into thin wafers. Ensures wire alignment and tension during high-precision slicing. Classified as part of wafer slicing saws under 8479.89.10 per 8479.90.41.00.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Calculate with your customs value Verify classification with AI

Import Tips

• Document the specific wafer slicing saw model (8479.89.10) this guide fits,Include wafer thickness specifications (typically 100-300μm) in technical data