Wafer Slicing Diamond Wire Guide from Japan
Precision guide assembly for diamond wire wafer slicing saws that cut semiconductor boules into thin wafers. Ensures wire alignment and tension during high-precision slicing. Classified as part of wafer slicing saws under 8479.89.10 per 8479.90.41.00.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document the specific wafer slicing saw model (8479.89.10) this guide fits,Include wafer thickness specifications (typically 100-300μm) in technical data