Wafer Slicing Diamond Wire Guide from Mexico
Precision guide assembly for diamond wire wafer slicing saws that cut semiconductor boules into thin wafers. Ensures wire alignment and tension during high-precision slicing. Classified as part of wafer slicing saws under 8479.89.10 per 8479.90.41.00.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document the specific wafer slicing saw model (8479.89.10) this guide fits,Include wafer thickness specifications (typically 100-300μm) in technical data