Wafer Slicing Diamond Wire Guide from China
Precision guide assembly for diamond wire wafer slicing saws that cut semiconductor boules into thin wafers. Ensures wire alignment and tension during high-precision slicing. Classified as part of wafer slicing saws under 8479.89.10 per 8479.90.41.00.
Duty Rate — China → United States
20%
Rate breakdown
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Document the specific wafer slicing saw model (8479.89.10) this guide fits,Include wafer thickness specifications (typically 100-300μm) in technical data