Rebuilt Wafer Lapping Machine NTC-82S
Used numerically controlled lapping machine for flattening semiconductor wafers to optical tolerances by cermet removal. HTS 8461.90.30.60 covers this rebuilt tool for other metalworking processes. Critical step after grinding in wafer preparation.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If semiconductor wafer lapping/polishing
Explicitly listed in statistical notes for semiconductor apparatus.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Document lapping plate material and flatness specs (e.g
• <1μ)
• Obtain SEMI-GAS compatibility certification
Related Products under HTS 8461.90.30.60
Rebuilt Wafer Edge Profiling Machine
NC machine tool for profiling edges of semiconductor wafers post-polishing, removing excess material. HTS 8461.90.30.60 as used/rebuilt other NC metal/cermet removal tool. Prevents chipping during handling.
Used Haas VF-2 Vertical Machining Center
A rebuilt numerically controlled vertical machining center used for milling, drilling, and shaping metal parts by removing material. It falls under HTS 8461.90.30.60 as a used or rebuilt NC machine tool for metal or cermet removal, not specified elsewhere. Commonly refurbished for semiconductor wafer grinding applications.
Rebuilt Okamoto ACC-3224DX Wafer Grinder
A numerically controlled grinder rebuilt for precision grinding of semiconductor wafers to exact tolerances by removing cermet or metal material. Classified under HTS 8461.90.30.60 as used/rebuilt NC machine tool for material removal in semiconductor prep. Ensures flatness critical for wafer fabrication processes.
Used Mazak SmoothG CNC Gear Hobbing Machine
Rebuilt numerically controlled hobbing machine for cutting precise gears from metal blanks by material removal. Classifies to HTS 8461.90.30.60 as used NC machine tool working by removing metal, other than specified gear types. Suitable for cermet gear finishing in precision applications.
Used Brother Speedio S300X3 5-Axis Machining Center
Rebuilt 5-axis NC machining center for complex contour shaping and slotting of hard metal/cermet parts. Falls under HTS 8461.90.30.60 as used numerically controlled other machine tools removing material. Used in semiconductor equipment component fabrication.
Rebuilt Disco Wafer Polisher DGP-8735
Numerically controlled polishing machine rebuilt for final surface finishing of semiconductor wafers by controlled material removal. HTS 8461.90.30.60 for used NC polishers working on metal/cermets. Achieves mirror finish required for device fabrication.