Used or rebuilt
Machine tools for planing, shaping, slotting, broaching, gear cutting, gear grinding or gear finishing, sawing, cutting-off and other machine tools working by removing metal or cermets, not elsewhere specified or included: > Other: > Numerically controlled > Other: > Used or rebuilt
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8461.90.30.60
Rebuilt Wafer Edge Profiling Machine
NC machine tool for profiling edges of semiconductor wafers post-polishing, removing excess material. HTS 8461.90.30.60 as used/rebuilt other NC metal/cermet removal tool. Prevents chipping during handling.
Used Haas VF-2 Vertical Machining Center
A rebuilt numerically controlled vertical machining center used for milling, drilling, and shaping metal parts by removing material. It falls under HTS 8461.90.30.60 as a used or rebuilt NC machine tool for metal or cermet removal, not specified elsewhere. Commonly refurbished for semiconductor wafer grinding applications.
Rebuilt Okamoto ACC-3224DX Wafer Grinder
A numerically controlled grinder rebuilt for precision grinding of semiconductor wafers to exact tolerances by removing cermet or metal material. Classified under HTS 8461.90.30.60 as used/rebuilt NC machine tool for material removal in semiconductor prep. Ensures flatness critical for wafer fabrication processes.
Used Mazak SmoothG CNC Gear Hobbing Machine
Rebuilt numerically controlled hobbing machine for cutting precise gears from metal blanks by material removal. Classifies to HTS 8461.90.30.60 as used NC machine tool working by removing metal, other than specified gear types. Suitable for cermet gear finishing in precision applications.
Used Brother Speedio S300X3 5-Axis Machining Center
Rebuilt 5-axis NC machining center for complex contour shaping and slotting of hard metal/cermet parts. Falls under HTS 8461.90.30.60 as used numerically controlled other machine tools removing material. Used in semiconductor equipment component fabrication.
Rebuilt Disco Wafer Polisher DGP-8735
Numerically controlled polishing machine rebuilt for final surface finishing of semiconductor wafers by controlled material removal. HTS 8461.90.30.60 for used NC polishers working on metal/cermets. Achieves mirror finish required for device fabrication.
Used DMG Mori NLX 2500 Gear Shaper
Rebuilt NC shaper for producing internal/external gear teeth by metal removal process. Classified HTS 8461.90.30.60 as used numerically controlled shaping machine, other. Precision for cermet gears in industrial applications.
Used Disco DFG-7340 Wafer Slicing Saw
Rebuilt NC saw for slicing monocrystalline semiconductor boules into thin wafers by precise cutting-off metal/cermet material. Fits HTS 8461.90.30.60 as used numerically controlled sawing machine not elsewhere specified. Essential for wafer preparation from Czochralski-grown crystals.
Rebuilt Crystec Crystal Boule Grinder
Numerically controlled grinder used/rebuilt to shape semiconductor crystal boules to precise diameters and flats indicating conductivity. Under HTS 8461.90.30.60 for used NC metal/cermet removal tools in wafer manufacturing. Prepares boules for slicing in float zone or Czochralski methods.
Rebuilt Wafer Lapping Machine NTC-82S
Used numerically controlled lapping machine for flattening semiconductor wafers to optical tolerances by cermet removal. HTS 8461.90.30.60 covers this rebuilt tool for other metalworking processes. Critical step after grinding in wafer preparation.