Used Disco DFG-7340 Wafer Slicing Saw
Rebuilt NC saw for slicing monocrystalline semiconductor boules into thin wafers by precise cutting-off metal/cermet material. Fits HTS 8461.90.30.60 as used numerically controlled sawing machine not elsewhere specified. Essential for wafer preparation from Czochralski-grown crystals.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If not numerically controlled
Non-NC sawing machines for metal removal are in 8461.50.
If exclusively for semiconductor boule slicing
Semiconductor-specific slicing saws covered under Chapter 84 statistical provisions.
If imported as saw blades only, not complete machine
Circular saw blades separate from the machine tool itself.
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Import Tips & Compliance
• Include blade specifications and kerf loss data for accurate classification
• Require rebuild affidavits from authorized service centers like Disco
Related Products under HTS 8461.90.30.60
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Used Mazak SmoothG CNC Gear Hobbing Machine
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