8461.90.30.60/Used Disco DFG-7340 Wafer Slicing Saw/China

Used Disco DFG-7340 Wafer Slicing Saw from China

Rebuilt NC saw for slicing monocrystalline semiconductor boules into thin wafers by precise cutting-off metal/cermet material. Fits HTS 8461.90.30.60 as used numerically controlled sawing machine not elsewhere specified. Essential for wafer preparation from Czochralski-grown crystals.

Duty Rate — China → United States

39.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
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Import Tips

• Include blade specifications and kerf loss data for accurate classification

• Require rebuild affidavits from authorized service centers like Disco

Used Disco DFG-7340 Wafer Slicing Saw from China — Import Duty Rate | HTS 8461.90.30.60