Used Disco DFG-7340 Wafer Slicing Saw from China
Rebuilt NC saw for slicing monocrystalline semiconductor boules into thin wafers by precise cutting-off metal/cermet material. Fits HTS 8461.90.30.60 as used numerically controlled sawing machine not elsewhere specified. Essential for wafer preparation from Czochralski-grown crystals.
Duty Rate — China → United States
41.9%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Include blade specifications and kerf loss data for accurate classification
• Require rebuild affidavits from authorized service centers like Disco