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8461.90.30.60/Used Disco DFG-7340 Wafer Slicing Saw/Japan

Used Disco DFG-7340 Wafer Slicing Saw from Japan

Rebuilt NC saw for slicing monocrystalline semiconductor boules into thin wafers by precise cutting-off metal/cermet material. Fits HTS 8461.90.30.60 as used numerically controlled sawing machine not elsewhere specified. Essential for wafer preparation from Czochralski-grown crystals.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include blade specifications and kerf loss data for accurate classification

• Require rebuild affidavits from authorized service centers like Disco

Used Disco DFG-7340 Wafer Slicing Saw from Japan — Import Duty Rate | HTS 8461.90.30.60