Used Haas VF-2 Vertical Machining Center

A rebuilt numerically controlled vertical machining center used for milling, drilling, and shaping metal parts by removing material. It falls under HTS 8461.90.30.60 as a used or rebuilt NC machine tool for metal or cermet removal, not specified elsewhere. Commonly refurbished for semiconductor wafer grinding applications.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China4.4%+35.0%39.4%
🇲🇽Mexico4.4%+10.0%14.4%
🇨🇦Canada4.4%+10.0%14.4%
🇩🇪Germany4.4%+10.0%14.4%
🇯🇵Japan4.4%+10.0%14.4%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8465.91.00Lower: 38% vs 39.4%

If primarily for gear finishing operations

Gear-specific NC machine tools are classified under heading 8465, not general metal removal tools.

8479.89.65.00Lower: 20.3% vs 39.4%

If dedicated to semiconductor wafer preparation

Machines solely for semiconductor processing like wafer grinding fall under Chapter 84 statistical notes for semiconductor equipment.

8466.94Lower: 14.7% vs 39.4%

If sold as parts rather than complete rebuilt machine

Individual rebuilt components or accessories for machine tools are classified under heading 8466.

Not sure which classification is right?

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Import Tips & Compliance

Verify refurbishment documentation and obtain a used machinery inspection certificate to prove condition

Include detailed service history and CNC software licenses to avoid reclassification as new

Check for EPA compliance if hydraulic systems are present; common pitfall is missing origin certificates

Related Products under HTS 8461.90.30.60

Rebuilt Wafer Edge Profiling Machine

NC machine tool for profiling edges of semiconductor wafers post-polishing, removing excess material. HTS 8461.90.30.60 as used/rebuilt other NC metal/cermet removal tool. Prevents chipping during handling.

Rebuilt Okamoto ACC-3224DX Wafer Grinder

A numerically controlled grinder rebuilt for precision grinding of semiconductor wafers to exact tolerances by removing cermet or metal material. Classified under HTS 8461.90.30.60 as used/rebuilt NC machine tool for material removal in semiconductor prep. Ensures flatness critical for wafer fabrication processes.

Used Mazak SmoothG CNC Gear Hobbing Machine

Rebuilt numerically controlled hobbing machine for cutting precise gears from metal blanks by material removal. Classifies to HTS 8461.90.30.60 as used NC machine tool working by removing metal, other than specified gear types. Suitable for cermet gear finishing in precision applications.

Used Brother Speedio S300X3 5-Axis Machining Center

Rebuilt 5-axis NC machining center for complex contour shaping and slotting of hard metal/cermet parts. Falls under HTS 8461.90.30.60 as used numerically controlled other machine tools removing material. Used in semiconductor equipment component fabrication.

Rebuilt Disco Wafer Polisher DGP-8735

Numerically controlled polishing machine rebuilt for final surface finishing of semiconductor wafers by controlled material removal. HTS 8461.90.30.60 for used NC polishers working on metal/cermets. Achieves mirror finish required for device fabrication.

Used DMG Mori NLX 2500 Gear Shaper

Rebuilt NC shaper for producing internal/external gear teeth by metal removal process. Classified HTS 8461.90.30.60 as used numerically controlled shaping machine, other. Precision for cermet gears in industrial applications.